IEC 60749-15:2010 Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Abstract
IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2010-10-28 |
Withdrawal date | 2020-07-14 |
Edition | 2.0 |
Available language(s) | English/French, Spanish |
TC/SC | TC 47 - Semiconductor devicesrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2020 |
Pages | 14 |
File size | 929 KB |
The following test report forms are related:
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