IEC 60749-22:2002 

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

CHF 

Do you need a multi-user copy?

CHF 

Preview

Abstract

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.

Look inside


Additional information

Publication typeInternational Standard
Publication date2002-09-12
Edition1.0
Available language(s)English/French, Spanish
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2025
Pages41
File size611 KB

The following test report forms are related:



Share your publications

Learn how to share your publications with your colleagues, using networking options.

Payment information

Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa), PayPal and bank transfers as form of payment.


Keep in touch

Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.

Contact customer services

Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 17:00 CET Monday to Friday.