IEC 61163-2:1998 Withdrawn
Reliability stress screening - Part 2: Electronic components
Abstract
Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 1998-11-27 |
| Withdrawal date | 2020-03-11 |
| Edition | 1.0 |
| Available language(s) | English/French, Spanish |
| TC/SC | TC 56 - Dependabilityrss |
| ICS | 03.120.01 - Quality in general
31.020 - Electronic components in general |
| Stability date | 2020 |
| Pages | 69 |
| File size | 560 KB |
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