IEC 61189-6:2006 Withdrawn
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
Note: this publication has been partially replaced by IEC 61189-5-501:2021 IEC 61189-5-502:2021
Abstract
IEC 61189-6:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2006-07-24 |
| Withdrawal date | 2024-03-28 |
| Edition | 1.0 |
| Available language(s) | English, English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards |
| Stability date | 2024 |
| Pages | 83 |
| File size | 1468 KB |
The following test report forms are related:
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