IEC 61249-3-5:1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Abstract
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 1999-02-10 |
| Edition | 1.0 |
| Available language(s) | English, English/French, Spanish |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards |
| Stability date | 2026 |
| Pages | 25 |
| File size | 904 KB |
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