Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
|Publication type||International Standard|
|Available language(s)||English, English/French, Spanish|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||31.180 - Printed circuits and boards|
|File size||904 KB|
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