IEC 61249-5-1:1995
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
Abstract
Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 1995-11-28 |
| Edition | 1.0 |
| Available language(s) | English/French, Spanish |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards |
| Stability date | 2028 |
| Pages | 39 |
| File size | 1424 KB |
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