IEC 61249-8-8:1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Abstract
Provides requirements for the qualification of temporary solder resist coatings.
Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
Additional information
Publication type | International Standard |
---|---|
Publication date | 1997-06-24 |
Edition | 1.0 |
Available language(s) | English/French, Spanish |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.180 - Printed circuits and boards |
Stability date | 2026 |
Pages | 19 |
File size | 92 KB |
The following test report forms are related:
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