IEC TR 60068-3-12:2014 

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

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Abstract

IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes. This edition includes the following significant technical changes with respect to the previous edition:
- the content has been adapted to the state-of-the-art of reflow-oven technology and termination finishes;
- minor language adjustments were performed.

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Additional information

Publication typeTechnical Report
Publication date2014-10-17
Edition2.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS19.040 - Environmental testing
Stability date  2020
Pages35
File size3316 KB

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