IEC 60068-2-58:2015+AMD1:2017 CSV
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- the addition of Sn-Bi low temperature solder alloy;
- the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method;
- introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization;
- implementation of guidance for the choice of a test severity in Clause B.3.
This consolidated version consists of the fourth edition (2015) and its amendment 1 (2017). Therefore, no need to order amendment in addition to this publication.
|Publication type||International Standard|
|Available language(s)||English, English/French|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||19.040 - Environmental testing
31.190 - Electronic component assemblies
|File size||3768 KB|
The following test report forms are related:
Share your publications
Learn how to share your publications with your colleagues, using networking options.
Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa, JCB and CUP), PayPal and bank transfers as form of payment.
Keep in touch
Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.
Contact customer services
Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 17:00 CET Monday to Friday.