IEC 60286-3:2019 RLV 
Redline version

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

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Abstract

IEC 60286-3:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
 

IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
- addition of a table of the classification to symbols concerning tape, reel and common symbols;
- additions of a figure of example of polarity and orientation and a figure of example of dot seal;
- revision of requirements for camber;
- addition of a definition of design value with regard to tilt.

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Additional information

Publication typeInternational Standard
Publication date2019-01-16
Edition6.0
Available language(s)English
TC/SCTC 40 - Capacitors and resistors for electronic equipmentrss
ICS31.020 - Electronic components in general
31.240 - Mechanical structures for electronic equipment
Stability date  2024
Pages125
File size3513 KB

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