IEC 60286-3:2022 

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

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IEC 60286-3:2022 CMV

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Abstract

IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
  1. addition terms and definitions.
  2. addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre;
  3. addition of drive hole to the reel (optional);
  4. revision of reel hole diameter tolerances;
  5. revision of 72 mm tape size carrier tape width dimension tolerances;
  6. addition of Annex B (informative);
  7. addition of component size 0201M.

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Additional information

Publication typeInternational Standard
Publication date2022-11-15
Edition7.0
Available language(s)English/French
TC/SCTC 40 - Capacitors and resistors for electronic equipmentrss
ICS31.020 - Electronic components in general
31.240 - Mechanical structures for electronic equipment
Stability date  2029
Pages113
File size4633 KB

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