IEC 63055:2023
Format for LSI-Package-Board Interoperable design
Abstract
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2023-10-11 |
Edition | 2.0 |
Available language(s) | English |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.180 - Printed circuits and boards 31.200 - Integrated circuits. Microelectronics 35.060 - Languages used in information technology |
Stability date | 2028 |
Pages | 292 |
File size | 10433 KB |
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