IEC 60191-6-10:2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Abstract
IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2003-11-19 |
| Edition | 1.0 |
| Available language(s) | English, English/French, Spanish |
| TC/SC | TC 47/SC 47D - Semiconductor devices packagingrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2027 |
| Pages | 24 |
| File size | 1186 KB |
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