IEC 62899-202-5:2018 

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

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Abstract

IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

 

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Additional information

Publication typeInternational Standard
Publication date2018-09-28
Edition1.0
Available language(s)English
TC/SCTC 119 - Printed Electronicsrss
ICS31.180 - Printed circuits and boards
87.080 - Inks. Printing inks
Stability date  2023
Pages15
File size1684 KB

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