IEC 62899-202-5:2018
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
Abstract
IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2018-09-28 |
Edition | 1.0 |
Available language(s) | English |
TC/SC | TC 119 - Printed Electronicsrss |
ICS | 31.180 - Printed circuits and boards 87.080 - Inks. Printing inks |
Stability date | 2026 |
Pages | 15 |
File size | 1684 KB |
The following test report forms are related:
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