IEC 60194-2:2017
Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
Abstract
IEC 60194-2:2017(E) covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.
This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC 60194:2015:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the electronics assembly industry;
c) inclusion of 13 new terms related with device embedded substrate technology;
d) removal of identification codes for terms as well as annexes.
This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC 60194:2015:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the electronics assembly industry;
c) inclusion of 13 new terms related with device embedded substrate technology;
d) removal of identification codes for terms as well as annexes.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2017-12-13 |
Edition | 1.0 |
Available language(s) | English |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.180 - Printed circuits and boards 31.190 - Electronic component assemblies |
Stability date | 2025 |
Pages | 45 |
File size | 1578 KB |
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