IEC 60749-3:2016 PRV 
Pre release version

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

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Abstract

This Final Draft International Standard is an up to 6 weeks' pre-release of the official publication. It is available for sale during its voting period: 2016-12-23 to 2017-02-03. By purchasing this FDIS now, you will automatically receive, in addition, the final publication.

IEC 60749-3 Ed.2.0 (E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.

This edition includes the following significant technical changes with respect to the previous edition:
a)   reference to the need for ESD protection;
b)   inclusion of information on the phenomenon of tin whiskers;
c)   inclusion of an optional report form/checklist.

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Additional information

Publication typeInternational Standard
Publication date2016-12-23
Edition2.0
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date2022
Hardcopy11  pages
File size933 KB

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