IEC 62047-2:2006
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Abstract
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2006-08-15 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 47/SC 47F - Micro-electromechanical systemsrss |
ICS | 31.080.99 - Other semiconductor devices |
Stability date | 2026 |
Pages | 25 |
File size | 449 KB |
The following test report forms are related:
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