IEC TR 60286-7:2019 

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components


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IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

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Additional information

Publication typeTechnical Report
Publication date2019-10-14
Available language(s)English/French
TC/SCTC 40 - Capacitors and resistors for electronic equipmentrss
ICS31.020 - Electronic components in general
31.240 - Mechanical structures for electronic equipment
Stability date  2027
File size3034 KB

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