IEC TR 60286-7:2019
Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
Abstract
IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.
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Additional information
| Publication type | Technical Report |
|---|---|
| Publication date | 2019-10-14 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 40 - Capacitors and resistors for electronic equipmentrss |
| ICS | 31.020 - Electronic components in general
31.240 - Mechanical structures for electronic equipment |
| Stability date | 2028 |
| Pages | 24 |
| File size | 3034 KB |
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