IEC 62769-2:2023
Field Device Integration (FDI®) - Part 2: Client
Note: a redline version of this publication exists
IEC 62769-2:2023 RLV
Abstract
IEC 62769-2:2023 is available as IEC 62769-2:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-2:2023 specifies the FDI®[1] Client. See Annex C for some typical FDI® Client use cases. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2023-04-04 |
Edition | 3.0 |
Available language(s) | English/French |
TC/SC | TC 65/SC 65E - Devices and integration in enterprise systemsrss |
ICS | 25.040.40 - Industrial process measurement and control 35.100.05 - Multilayer applications |
Stability date | 2025 |
Pages | 311 |
File size | 4804 KB |
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