IEC 62769-6:2023
Field Device Integration (FDI®) - Part 6: FDI Technology Mappings
Note: a redline version of this publication exists
IEC 62769-6:2023 RLV
Abstract
IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2023-04-06 |
| Edition | 3.0 |
| Available language(s) | English/French |
| TC/SC | TC 65/SC 65E - Devices and integration in enterprise systemsrss |
| ICS | 25.040.40 - Industrial process measurement and control 35.100.05 - Multilayer applications |
| Stability date | 2025 |
| Pages | 14 |
| File size | 563 KB |
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