IEC 62899-202:2023 RLV
Redline version
Printed electronics - Part 202: Materials - Conductive ink
Abstract
IEC 62899-202:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 62899-202:2023 defines the terms and specifies the standard test methods for characterization and evaluation of conductive inks. This document also provides measurement methods for evaluating the properties of conductive layers made both from an additive process using conductive inks and from a subtractive process used in printed electronics. This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of conductive material, conductive ink and conductive layer have been revised;
b) a summary of test methods is added;
c) mechanical tests for conductive layer are added.
IEC 62899-202:2023 defines the terms and specifies the standard test methods for characterization and evaluation of conductive inks. This document also provides measurement methods for evaluating the properties of conductive layers made both from an additive process using conductive inks and from a subtractive process used in printed electronics. This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of conductive material, conductive ink and conductive layer have been revised;
b) a summary of test methods is added;
c) mechanical tests for conductive layer are added.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2023-05-02 |
Edition | 2.0 |
Available language(s) | English |
TC/SC | TC 119 - Printed Electronicsrss |
ICS | 31.180 - Printed circuits and boards 87.080 - Inks. Printing inks |
Stability date | 2028 |
Pages | 74 |
File size | 1791 KB |
The following test report forms are related:
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