IEC TS 62878-2-3:2015 

Device embedded substrate - Part 2-3: Guidelines - Design guide

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Abstract

IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

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Additional information

Publication typeTechnical Specification
Publication date2015-03-27
Edition1.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
31.190 - Electronic component assemblies
Stability date  2022
Pages50
File size2534 KB

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