IEC TS 62878-2-3:2015 

Device embedded substrate - Part 2-3: Guidelines - Design guide


Do you need a multi-user copy?




IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

Look inside

Additional information

Publication typeTechnical Specification
Publication date2015-03-27
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
31.190 - Electronic component assemblies
Stability date  2022
File size2534 KB

The following test report forms are related:

Share your publications

Learn how to share your publications with your colleagues, using networking options.

Payment information

Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa), PayPal and bank transfers as form of payment.

Keep in touch

Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.

Contact customer services

Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 17:00 CET Monday to Friday.