IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Abstract
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2019-10-14 |
Edition | 1.0 |
Available language(s) | English, English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.180 - Printed circuits and boards 31.190 - Electronic component assemblies |
Stability date | 2025 |
Pages | 38 |
File size | 1681 KB |
The following test report forms are related:
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