IEC 61188-5-4:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Note: this publication has been partially replaced by IEC 61188-6-2:2021
Abstract
IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2007-10-29 |
| Edition | 1.0 |
| Available language(s) | English, English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards |
| Stability date | 2025 |
| Pages | 29 |
| File size | 1018 KB |
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