IEC 61188-5-8:2007
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Note: this publication has been partially replaced by IEC 61188-6-2:2021
Abstract
IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.
This publication is to be read in conjunction with IEC 61188-5-1:2002.
This publication is to be read in conjunction with IEC 61188-5-1:2002.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2007-10-29 |
Edition | 1.0 |
Available language(s) | English, English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.180 - Printed circuits and boards |
Stability date | 2025 |
Pages | 61 |
File size | 1363 KB |
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