IEC 61189-1:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
Note: a more recent version of this publication exists
IEC 61189-1:1997+AMD1:2001 CSV
Abstract
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 1997-03-27 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards |
| Stability date | 2028 |
| Pages | 37 |
| File size | 129 KB |
The following test report forms are related:
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