IEC 61189-1:1997 

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

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IEC 61189-1:1997+AMD1:2001 CSV

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Abstract

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

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Additional information

Publication typeInternational Standard
Publication date1997-03-26
Edition1.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
Stability date  2020
Pages37
File size129 KB

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