IEC 61189-2:2006 

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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Abstract

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

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Additional information

Publication typeInternational Standard
Publication date2006-05-30
Edition2.0
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
Stability date  2020
Pages122
File size1228 KB

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