IEC 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Abstract
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2006-05-30 |
| Edition | 2.0 |
| Available language(s) | English |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards |
| Stability date | 2028 |
| Pages | 122 |
| File size | 1228 KB |
The following test report forms are related:
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