IEC 61760-2:2021 

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Note: a redline version of this publication exists
IEC 61760-2:2021 RLV

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Abstract

IEC 61760-2:2021 is available as IEC 61760-2:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.

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Additional information

Publication typeInternational Standard
Publication date2021-07-16
Edition3.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.240 - Mechanical structures for electronic equipment
Stability date  2026
Pages29
File size1517 KB

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