IEC 60749-20:2020 RLV
Redline version
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Abstract
IEC 60749-20:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.
IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.
Look inside
Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2020-08-31 |
| Edition | 3.0 |
| Available language(s) | English |
| TC/SC | TC 47 - Semiconductor devicesrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2030 |
| Pages | 82 |
| File size | 2896 KB |
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