IEC 62878-1-1:2015
Device embedded substrate - Part 1-1: Generic specification - Test methods
Abstract
IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2015-05-20 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards 31.190 - Electronic component assemblies |
| Stability date | 2026 |
| Pages | 109 |
| File size | 2893 KB |
The following test report forms are related:
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