IEC 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Abstract
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2016-01-05 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.180 - Printed circuits and boards |
Stability date | 2028 |
Pages | 22 |
File size | 1348 KB |
The following test report forms are related:
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