IEC 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
Abstract
IEC 61189-5-1:2016 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2016-07-05 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.180 - Printed circuits and boards |
Stability date | 2026 |
Pages | 53 |
File size | 1446 KB |
The following test report forms are related:
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