IEC 61191-4:2017
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Abstract
IEC 61191-4:2017 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2017-07-26 |
| Edition | 2.0 |
| Available language(s) | English, English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.240 - Mechanical structures for electronic equipment |
| Stability date | 2025 |
| Pages | 38 |
| File size | 1605 KB |
The following test report forms are related:
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