IEC 61191-3:2017 

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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Abstract

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

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Additional information

Publication typeInternational Standard
Publication date2017-05-30
Edition2.0
Available language(s)English, English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.240 - Mechanical structures for electronic equipment
Stability date  2024
Pages40
File size1368 KB

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