Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.
|Publication type||International Standard|
|Available language(s)||English, English/French|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||31.190 - Electronic component assemblies
31.240 - Mechanical structures for electronic equipment
|File size||2134 KB|
The following test report forms are related:
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