IEC 61191-2:2017 

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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Abstract

IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.

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Additional information

Publication typeInternational Standard
Publication date2017-05-23
Edition3.0
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
31.240 - Mechanical structures for electronic equipment
Stability date  2024
Pages33
File size1733 KB

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