IEC TR 61191-7:2020
Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
Abstract
IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
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Additional information
| Publication type | Technical Report |
|---|---|
| Publication date | 2020-03-11 |
| Edition | 1.0 |
| Available language(s) | English |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards 31.190 - Electronic component assemblies |
| Stability date | 2025 |
| Pages | 115 |
| File size | 47785 KB |
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