IEC TR 61191-7:2020 

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies


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IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

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Additional information

Publication typeTechnical Report
Publication date2020-03-11
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
31.190 - Electronic component assemblies
Stability date  2025
File size47785 KB

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