IEC 61191-1:2018 RLV 
Redline version

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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Abstract

IEC 61191-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.

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Additional information

Publication typeInternational Standard
Publication date2018-09-14
Edition3.0
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
31.240 - Mechanical structures for electronic equipment
Stability date  2025
Pages140
File size2478 KB

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